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After Samsung, LG Innotek Deepens Korea’s Semiconductor Push in Vietnam
LG Innotek is expanding its semiconductor substrate manufacturing footprint in Vietnam with a new facility in Hai Phong, marking another step in the company’s plan to position Vietnam as a mass-production base while keeping higher-value technology development in Korea.
The plant will produce advanced chip substrates, including RF-SiP, FC-CSP, and FC-BGA, which are key components used to connect semiconductors with electronic devices and support higher-performance applications.
Construction is scheduled to begin in July 2026, with completion targeted for May 2027. The facility will cover around 330,000 square meters, roughly the size of 45 football fields, and will be funded directly by LG Innotek’s Vietnamese subsidiary.
The timing is also important.
Just a few days earlier, Samsung was reported to be planning a USD1.5bn chip testing facility in Thai Nguyen. Together, Samsung’s chip-testing project and LG Innotek’s substrate expansion suggest that Korean technology companies are not only maintaining their existing manufacturing presence in Vietnam, but also broadening it into more specialized semiconductor-related activities.
This comes shortly after South Korean President Lee Jae Myung’s state visit to Vietnam, where both countries emphasized deeper cooperation beyond traditional trade and manufacturing, including infrastructure, energy, technology, and strategic industries. The latest moves by Samsung and LG Innotek are a practical illustration of that direction: high-level diplomatic commitments are being translated into real industrial projects.
For Vietnam, this matters because the country is no longer viewed only as a low-cost assembly base. With continued investments from Korean champions, Vietnam is gradually positioning itself as a more important manufacturing node in the global semiconductor ecosystem.
Original article from Korea Times
